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Fuji Seal-glo UF317H is a one-part, heat curing, epoxy resin, high flow underfill, specifically developed by Fuji Chemical Industrial Co Ltd, Japan, for use with CSP (Chip size Scale Package) and BGA (Ball Grid Array) packages. It has excellent adhesive strength and high humidity resistance.
UF317H underfill is designed to quickly fill the space underneath CSP and BGA packages, with a low temperature cure of just 120 degrees, thus minimising thermal stress to other components on the printed circuit board. Especially formulated to allow easy rework of components post underfill curing, it is totally compatible with lead-free solder pastes.
UF317H offers excellent protection to solder joints against shock, mechanical stress, vibration and accidental drop, whilst not degrading the thermal cycle performance inherent in the area array package itself. It is coated around the CSP/BGA (1-3 edges) after mounting and it penetrates the gap between the package and the circuit board by capillary forces for the process of heat curing.
Material Safety Data Sheet (*GHS Format) for Fuji UF317H
Click here to download PDF file. (*Globally Harmonised System of Classification of Chemicals).
Brochure for Fuji UF317H
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Comparison Data for Fuji UF317H
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Link to ECHA (European Chemicals Agency).
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